Wafer Cutting & Dicing
Precision diamond cutting and dicing solutions for semiconductor ingots, wafers and hard brittle electronic materials requiring narrow kerf, controlled edge quality and minimal material loss.
APPLICATION OVERVIEW
HANS provides precision diamond tooling solutions for cutting, slicing and sectioning silicon, silicon carbide (SiC), sapphire and other hard brittle semiconductor materials. Applications include ingot sectioning, wafer slicing, wafer sample preparation and precision dicing where low cutting force, narrow kerf and controlled material removal are critical.
KEY CHALLENGES
Semiconductor materials such as SiC and sapphire combine high hardness, brittleness and high material value. Cutting can introduce edge chipping, microcracks, kerf loss, wafer breakage and subsurface damage that may affect subsequent grinding, lapping and polishing operations.
RECOMMENDED SOLUTIONS
HANS offers fine continuous diamond wire loops and segmented diamond wire loops for precision ingot sectioning, ultra-thin diamond saw blades and precision cutting discs for wafer slicing and sample dicing. Diamond grit, blade thickness, wire diameter and cutting configuration can be customized according to material, wafer dimensions and required surface quality.
KEY BENEFITS
HANS offers fine continuous diamond wire loops and segmented diamond wire loops for precision ingot sectioning, ultra-thin diamond saw blades and precision cutting discs for wafer slicing and sample dicing. Diamond grit, blade thickness, wire diameter and cutting configuration can be customized according to material, wafer dimensions and required surface quality.
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