Semiconductor Materials
Precision diamond tooling solutions for cutting, sectioning, grinding, lapping and surface preparation of silicon, silicon carbide, sapphire and other hard semiconductor materials.
INDUSTRY OVERVIEW
HANS provides precision diamond and superabrasive tooling solutions for processing semiconductor and electronic materials. Our solutions support cutting, sectioning, edge grinding, thinning, lapping and surface preparation of silicon, silicon carbide (SiC), sapphire, technical ceramics and other hard and brittle materials used in semiconductor manufacturing and research.
KEY CHALLENGES
Semiconductor materials require extremely controlled processing to minimize kerf loss, edge chipping, microcracks, subsurface damage and surface defects. Materials such as silicon carbide and sapphire combine high hardness with brittleness, requiring carefully selected diamond abrasives, tool geometry and progressive finishing processes.
RECOMMENDED SOLUTIONS
Recommended solutions include continuous and segmented diamond wire loops for precision material sectioning, thin diamond saw blades for controlled cutting, precision diamond grinding wheels for edge grinding and material removal, diamond lapping films and discs for surface preparation, and fine diamond abrasives for progressive finishing. Custom wire diameters, loop lengths, grit sizes and tool configurations are available.
KEY BENEFITS
Narrow kerf, reduced material loss, controlled cutting forces, reduced edge damage, precise material removal and consistent surface preparation. Custom diamond tooling solutions support semiconductor material development, laboratory processing and specialized manufacturing applications.
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