SPECIFICATION
CMP Polishing Slurry — SOQ-12D SiO2 110–130 nm
SKU / MODEL
SOQ-12D
DISPLAY SIZE
GRIT / MESH
SPECIFICATION
CMP Polishing Slurry — SO-100-PF SiO2 90–120 nm
SKU / MODEL
SO-100-PF
DISPLAY SIZE
GRIT / MESH
SPECIFICATION
CMP Polishing Slurry — SO-80-PF SiO2 70–90 nm
SKU / MODEL
SO-80-PF
DISPLAY SIZE
GRIT / MESH
SPECIFICATION
CMP Polishing Slurry — SO-60-PF SiO2 50–70 nm
SKU / MODEL
SO-60-PF
DISPLAY SIZE
GRIT / MESH
SPECIFICATION
CMP Polishing Slurry — SO-40-PF SiO2 30–50 nm
SKU / MODEL
SO-40-PF
DISPLAY SIZE
GRIT / MESH
SPECIFICATION
CMP Polishing Slurry — SO-20-PF SiO2 10–30 nm
SKU / MODEL
SO-20-PF
DISPLAY SIZE
GRIT / MESH
SPECIFICATION
CMP Polishing Slurry — Water-Based Reference Formulation
SKU / MODEL
DISPLAY SIZE
GRIT / MESH
SPECIFICATION
CMP Polishing Slurry — Oil-Based / Customized Carrier Reference
SKU / MODEL
DISPLAY SIZE
GRIT / MESH
SPECIFICATION
CMP Polishing Slurry — Custom Manufacturing RFQ Reference
SKU / MODEL
DISPLAY SIZE
GRIT / MESH
丨Technical Overview
PRODUCT SYSTEM
Precision Lapping & Polishing Products
PRODUCT TYPE
Polishing Slurries
TECHNOLOGY
Chemical Mechanical Planarization (CMP)
BOND TYPE
SiO2
GRIT
10nm-110nm
SPECIFICATIONS
KEY FEATURES
TECHNICAL DATA
HANS DIAMOND TOOLS / PRODUCT DETAILS
CMP Polishing Slurry
HANS CMP Polishing Slurry is a precision chemical mechanical planarization (CMP) solution designed for controlled material removal, surface planarization, and ultra-smooth finishing. Formulated for compatible semiconductor, optical, and advanced material processing applications, it combines chemical and mechanical polishing mechanisms to support uniform surface finishing, low surface roughness, and consistent polishing performance in precision manufacturing.