SPECIFICATION
11.0mm Sintered Diamond Wire Bead, H6.0 Working Layer, 11.0 mm Support Length
SKU / MODEL
DISPLAY SIZE
GRIT / MESH
SPECIFICATION
10.5mm Sintered Diamond Wire Bead, H6.4 / H5.8 Working Layer, 10.5 mm Support Length
SKU / MODEL
DISPLAY SIZE
GRIT / MESH
SPECIFICATION
φ11.0 Diamond Wire for Metal Cutting
SKU / MODEL
DISPLAY SIZE
GRIT / MESH
Diamond Wire for Metal Cutting
Diamond Wire for Metal Cutting is part of the HANS Diamond Wire & Wire Saw range. It is designed for diamond wire cutting, precision material sectioning, stone & construction and related industrial processing. Typical target materials include Granite & Hard Natural Stone, Marble, Concrete, Terrazzo & Cementitious Materials, Graphite, Silicon (Si). Available dimensions, abrasive specifications, mounting systems and operating configurations vary by product family. Refer to Product Specifications for confirmed sizes, grit or mesh, arbor or center-hole, segment, wire, machine-model and other technical parameters.
Specifications
Key Features
Technical Data
PRODUCT SYSTEM
Diamond Wire & Wire Saw Systems
PRODUCT TYPE
Diamond Wire
TECHNOLOGY
BOND TYPE
GRIT
Specifications
Key Features
Technical Data
PRODUCT SYSTEM
Diamond Wire & Wire Saw Systems
PRODUCT TYPE
Diamond Wire
TECHNOLOGY
BOND TYPE
GRIT
SPECIFICATION
11.0mm Sintered Diamond Wire Bead, H6.0 Working Layer, 11.0 mm Support Length
SKU / MODEL
SIZE
GRIT / MESH
SPECIFICATION
10.5mm Sintered Diamond Wire Bead, H6.4 / H5.8 Working Layer, 10.5 mm Support Length
SKU / MODEL
SIZE
GRIT / MESH
SPECIFICATION
φ11.0 Diamond Wire for Metal Cutting
SKU / MODEL
SIZE
GRIT / MESH
Diamond Wire for Metal Cutting
Diamond Wire for Metal Cutting is part of the HANS Diamond Wire & Wire Saw range. It is designed for diamond wire cutting, precision material sectioning, stone & construction and related industrial processing. Typical target materials include Granite & Hard Natural Stone, Marble, Concrete, Terrazzo & Cementitious Materials, Graphite, Silicon (Si). Available dimensions, abrasive specifications, mounting systems and operating configurations vary by product family. Refer to Product Specifications for confirmed sizes, grit or mesh, arbor or center-hole, segment, wire, machine-model and other technical parameters.
Specifications
Key Features
Technical Data
PRODUCT SYSTEM
Diamond Wire & Wire Saw Systems
PRODUCT TYPE
Diamond Wire
TECHNOLOGY
BOND TYPE
GRIT
Diamond Wire for Metal Cutting
Diamond Wire for Metal Cutting is part of the HANS Diamond Wire & Wire Saw range. It is designed for diamond wire cutting, precision material sectioning, stone & construction and related industrial processing. Typical target materials include Granite & Hard Natural Stone, Marble, Concrete, Terrazzo & Cementitious Materials, Graphite, Silicon (Si). Available dimensions, abrasive specifications, mounting systems and operating configurations vary by product family. Refer to Product Specifications for confirmed sizes, grit or mesh, arbor or center-hole, segment, wire, machine-model and other technical parameters.
SPECIFICATION
11.0mm Sintered Diamond Wire Bead, H6.0 Working Layer, 11.0 mm Support Length
SKU / MODEL
SIZE
GRIT / MESH
SPECIFICATION
10.5mm Sintered Diamond Wire Bead, H6.4 / H5.8 Working Layer, 10.5 mm Support Length
SKU / MODEL
SIZE
GRIT / MESH
SPECIFICATION
φ11.0 Diamond Wire for Metal Cutting
SKU / MODEL
SIZE
GRIT / MESH