SPECIFICATION
Semiconductor Polishing Slurry — Water-Based Reference Formulation
SKU / MODEL
DISPLAY SIZE
GRIT / MESH
SPECIFICATION
Semiconductor Polishing Slurry — Oil-Based / Customized Carrier Reference
SKU / MODEL
DISPLAY SIZE
GRIT / MESH
SPECIFICATION
Semiconductor Polishing Slurry — Custom Manufacturing RFQ Reference
SKU / MODEL
DISPLAY SIZE
GRIT / MESH
丨Technical Overview
PRODUCT SYSTEM
Precision Lapping & Polishing Products
PRODUCT TYPE
Polishing Slurries
TECHNOLOGY
Semiconductor CMP Abrasive Suspension
BOND TYPE
SiC/ AlN/GaN
GRIT
200-500nm
SPECIFICATIONS
KEY FEATURES
TECHNICAL DATA
HANS DIAMOND TOOLS / PRODUCT DETAILS
Semiconductor Polishing Slurry
HANS Semiconductor Polishing Slurry is a precision abrasive suspension designed for chemical mechanical planarization (CMP), wafer polishing, and ultra-fine surface finishing in semiconductor manufacturing. Formulated to support controlled material removal, excellent surface uniformity, and low-defect polishing, it is suitable for compatible semiconductor substrates and advanced electronic materials.