PRODUCT SPECIFICATIONS
Explore Diamond Tool Specifications
Browse detailed technical specifications for HANS diamond and superabrasive tools. Compare available sizes, grit grades, bond types, and product configurations to identify the right solution for your application.
Final Polishing Film — SiO2 8 nm — 127 mm Disc
Final Polishing Film
Nanometer SiO₂-coated polyester final polishing film for precision finishing of optical fiber connector end faces; GRISH-referenced 8–150 nm abrasive range.
Final Polishing Film — SiO2 50 nm — 127 mm Disc
Final Polishing Film
Nanometer SiO₂-coated polyester final polishing film for precision finishing of optical fiber connector end faces; GRISH-referenced 8–150 nm abrasive range.
Final Polishing Film — SiO2 150 nm — 203 mm Disc
Final Polishing Film
Nanometer SiO₂-coated polyester final polishing film for precision finishing of optical fiber connector end faces; GRISH-referenced 8–150 nm abrasive range.
Final Polishing Film — SiO2 8–150 nm — 152 × 152 mm Sheet
Final Polishing Film
Nanometer SiO₂-coated polyester final polishing film for precision finishing of optical fiber connector end faces; GRISH-referenced 8–150 nm abrasive range.
Diamond-Bead Polishing Tape — Sheet/Disc Format — Custom Size
Diamond-Bead Polishing Tape
Granulated diamond-bead coated polishing tape for precision fine finishing, with source-listed 0.7 µm and 1.5 µm primary particles.
Diamond-Bead Polishing Tape — Roll/Tape Format — Custom Width and Length
Diamond-Bead Polishing Tape
Granulated diamond-bead coated polishing tape for precision fine finishing, with source-listed 0.7 µm and 1.5 µm primary particles.
Detonation Nano Diamond Powder — Fine Grade — Custom Particle Size
Detonation Nano Diamond Powder
Detonation nanodiamond powder with nanoscale diamond particles for precision fine polishing.
Detonation Nano Diamond Powder — Coarse Grade — Custom Particle Size
Detonation Nano Diamond Powder
Detonation nanodiamond powder with nanoscale diamond particles for precision fine polishing.
Monocrystalline Diamond Slurry — Standard Reference Configuration
Monocrystalline Diamond Slurry
Water-based and oil-based monocrystalline diamond abrasive polishing slurry for hard-material finishing.
Monocrystalline Diamond Slurry — Custom Application Configuration
Monocrystalline Diamond Slurry
Water-based and oil-based monocrystalline diamond abrasive polishing slurry for hard-material finishing.
Silicon Carbide Polishing Slurry — Water-Based Reference Formulation
Silicon Carbide Polishing Slurry
Silicon carbide abrasive slurry for controlled lapping and surface finishing of ceramics, glass and hard materials.
Silicon Carbide Polishing Slurry — Oil-Based / Customized Carrier Reference
Silicon Carbide Polishing Slurry
Silicon carbide abrasive slurry for controlled lapping and surface finishing of ceramics, glass and hard materials.
Aluminum Oxide Polishing Slurry — Water-Based Reference Formulation
Aluminum Oxide Polishing Slurry
Fine aluminum oxide abrasive slurry for controlled lapping and surface polishing of glass, ceramics and metals.
Aluminum Oxide Polishing Slurry — Oil-Based / Customized Carrier Reference
Aluminum Oxide Polishing Slurry
Fine aluminum oxide abrasive slurry for controlled lapping and surface polishing of glass, ceramics and metals.
Cerium Oxide Polishing Slurry — Water-Based Reference Formulation
Cerium Oxide Polishing Slurry
Cerium oxide fine-polishing slurry for optical glass, lenses and mirror surface finishing.
Cerium Oxide Polishing Slurry — Oil-Based / Customized Carrier Reference
Cerium Oxide Polishing Slurry
Cerium oxide fine-polishing slurry for optical glass, lenses and mirror surface finishing.
CMP Polishing Slurry — Water-Based Reference Formulation
CMP Polishing Slurry
Chemical-mechanical planarization slurry for controlled wafer and precision substrate surface finishing.
CMP Polishing Slurry — Oil-Based / Customized Carrier Reference
CMP Polishing Slurry
Chemical-mechanical planarization slurry for controlled wafer and precision substrate surface finishing.
Semiconductor Polishing Slurry — Water-Based Reference Formulation
Semiconductor Polishing Slurry
Wafer and semiconductor substrate precision polishing slurry for chemical-mechanical planarization.
Semiconductor Polishing Slurry — Oil-Based / Customized Carrier Reference
Semiconductor Polishing Slurry
Wafer and semiconductor substrate precision polishing slurry for chemical-mechanical planarization.
High-Efficiency Lapping Agent — Water-Based Reference Formulation
High-Efficiency Lapping Agent
Water-soluble lapping agent for boron-carbide-assisted double-sided lapping processes.
High-Efficiency Lapping Agent — Oil-Based / Customized Carrier Reference
High-Efficiency Lapping Agent
Water-soluble lapping agent for boron-carbide-assisted double-sided lapping processes.
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