Diamond Wire Cutting
Precision diamond wire cutting solutions for low-force, narrow-kerf sectioning of hard, brittle, fragile and high-value materials.
APPLICATION OVERVIEW
HANS provides precision diamond wire cutting solutions for hard, brittle and difficult-to-machine materials where low cutting force, narrow kerf and controlled material removal are critical. Continuous and segmented diamond wire loops support precision cutting and sectioning of silicon, silicon carbide (SiC), sapphire, technical ceramics, quartz, optical glass, graphite, composites, geological specimens and other advanced materials.
KEY CHALLENGES
Conventional cutting methods can generate excessive cutting force, heat, chipping, cracking, kerf loss and subsurface damage when processing hard or brittle materials. Large, fragile or high-value workpieces also require controlled sectioning with minimal material waste and consistent cut quality.
RECOMMENDED SOLUTIONS
HANS continuous diamond wire loops and segmented diamond wire loops provide flexible solutions for precision material sectioning. Wire diameter, loop length, diamond grit size and abrasive configuration can be customized according to material properties, machine configuration, cutting speed, kerf requirements and desired surface quality.
KEY BENEFITS
HANS continuous diamond wire loops and segmented diamond wire loops provide flexible solutions for precision material sectioning. Wire diameter, loop length, diamond grit size and abrasive configuration can be customized according to material properties, machine configuration, cutting speed, kerf requirements and desired surface quality.
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