Precision Material Sectioning
Precision sectioning solutions for controlled cutting and sample preparation of hard, brittle, fragile and high-value materials with minimal kerf loss and material damage.
APPLICATION OVERVIEW
HANS provides precision material sectioning solutions for advanced materials requiring accurate cuts, controlled kerf width and minimal edge or subsurface damage. Applications range from semiconductor and ceramic sectioning to optical glass, quartz, graphite, composites, carbide and geological sample preparation. Depending on the material, dimensions and required cut quality, HANS offers diamond wire loops, ultra-thin diamond saw blades and precision diamond cutting tools for laboratory and industrial sectioning processes.
KEY CHALLENGES
Precision sectioning of hard and brittle materials can produce chipping, cracking, thermal damage, excessive kerf loss and deformation of delicate samples. High-value materials require controlled cutting forces and reliable abrasive performance to preserve material, geometry and the integrity of the resulting cross-section.
RECOMMENDED SOLUTIONS
HANS recommends continuous and segmented diamond wire loops for low-force and narrow-kerf sectioning, ultra-thin diamond saw blades for accurate slicing and sample preparation, and precision diamond cutting blades for controlled sectioning of hard materials. Tool dimensions, diamond grit, bond system and cutting configuration can be selected according to material properties, section thickness, machine configuration and surface-quality requirements.
KEY BENEFITS
HANS recommends continuous and segmented diamond wire loops for low-force and narrow-kerf sectioning, ultra-thin diamond saw blades for accurate slicing and sample preparation, and precision diamond cutting blades for controlled sectioning of hard materials. Tool dimensions, diamond grit, bond system and cutting configuration can be selected according to material properties, section thickness, machine configuration and surface-quality requirements.
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