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CMP Polishing Slurry — SO-60-PF SiO2 50–70 nm
SiO2 polishing slurry custom reference SO-60-PF, particle range 50–70 nm. HANS RFQ required.
Technical Specifications
Product System
Precision Lapping & Polishing Products
Product Type
Polishing Slurries
Technology
Colloidal Silica CMP Suspension
Bond Type
Grit
Size
Diameter
Width
Length
Thickness
Backing
Mounting
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